Nova R & D, Inc.

Products

Resources

RENA-3™: Readout Electronics for Nuclear Application. A 36-channel charge sensitive amplifier/shaper ASIC chip with trigger output and sparse readout mode for reading out position sensitive solid state detectors. The RENA-3 is an improved version of the prototype RENA-2 design which supersedes NOVA’s earlier 32-channel RENA chip. UCSD's HEXIS project uses the RENA chip.
XENA™: X-ray ENergy-binning Applications Applications. An integrated circuit for the fast readout of solid-state x-ray and gamma ray detectors with multi-energy capability, designed for the high-throughput N-Energy X-ray Image Scanning (NEXIS) system and similar x-ray imaging technologies. XENA and NEXIS supersede FESA and ABIS.
MPX-08™: Multianode Photomultiplier Electronics. A micropower charge-integrating readout system optimized for pulse analysis for photomultiplier tubes and similar detectors.
ACE™: Advanced Charge-conversion Electronics. A multi-channel charge sensitive amplifier/shaper ASIC chip with trigger output, wide dynamic range and on board ultra linear Wilkinson ADC for reading out multianode PMTs, APD arrays and position sensitive solid state detectors.

NEXIS™: N-Energy x-ray Image Scanning. NEXIS is modular detector system designed for high -flux, multiple-energy x-ray imaging. It consists essentially of detector boards equipped with linear (CdZnTe) detector arras read out by XENA signal processor chips. XENA and NEXIS supersede FESA and ABIS

MARY-N™: A pixel detector readout ASIC chip with 192 x 384 array of 50 x 50 micron pixel size for high resolution, high dynamic range industrial or medical x-ray imaging such as digital radiography, nondestructive evaluation or digital MAmmogRaphY. A new version of this chip is currently under development, as well as one with a 100 x 100 micron pixel pitch.

HILDA™: The HILDA IC (Hyperspectral Imaging with Large Detector Arrays) is a 16 x 16, 500mm pitch array of channels designed for high-rate photon counting and multiple-energy binning up to eight bands. Like the DANA, it is intended for use in flip-chip connection with a matching 2D detector pixel array. Such a 16 x 16, 500mm pitch CZT pixel array detector is currently in fabrication. The main application envisioned for this chip is munitions inspection.

DANA™: The DANA IC (Detector Array for Nuclear Applications Integrated Circuit) is a 16 x 16, 500mm pitch array of channels with a charge sensitive amplifier/shaper, trigger output and sparse readout intended for use in flip-chip connection with a spectroscopy-grade 2D detector pixel array. The advantages of such a readout channel array include lower input capacitance and noise, finer pixel pitch, more compact sensor readout assembly and ease of tiling array units into a large-area 2D array. On the other hand, its format entails the challenge of fitting complex circuitry within the unit cell area, developing the matching detector pixel array, and finding a solution for reliable and cost-effective IC-detector bonding.

N101VTF™: A four channel ultra high linearity (<50ppm) Voltage-to-Frequency Converter NIM module with onboard calibration capability.

CINDI™: Hand held portable substance detector. Can also be used for finding the position of obstruction in clogged pipes, detecting neutrons and gamma rays for controlling and monitoring nuclear proliferation.