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MPX Title
RENA-3

Key Features

  • The XENA has 32 signal channels plus two analog-only test channels
  • Self-resetting charge sensitive amplifiers
  • Input signals of either polarity
  • Multichannel monolithic construction
  • Good energy resolution
  • Charge sensitive amplifiers with fast pulse shaping
  • High count rate
  • Digitally adjustable gains and offsets
  • Pulse shaping time externally adjustable
  • Five fast comparators per channel with associated 16-bit counters
  • Five comparator threshold voltages, common to all channels, applied externally
  • Contains 160 counters that are read out sequentially over 16-bit parallel data bus
  • Readout of all 160 counters requires approximately 20 µs
  • Power consumption, 500 mW nominal
  • Submicron process fabrication

  Details

XENA™ (X-ray ENergy-binning Applications Applications) is an integrated circuit for the fast readout of solid-state x-ray and gamma ray detectors with multi-energy capability, designed for the high-throughput N-Energy X-ray Image Scanning (NEXIS) system and similar x-ray imaging technologies. XENA and NEXIS supersede FESA and ABIS.

Applications

The XENA™ chip is a 32-channel signal processor IC intended for use with modular detector systems. It is designed for detecting x-ray photons at high count rates, more than two million events per second per channel. Typical applications of the XENA™ chip include baggage or package inspection and bone densitometry. These procedures require x-ray detection at high photon flux at two to three or at most five energy levels, in order to image the average atomic number of the irradiated sample with high spatial resolution. The XENA™ has been successfully implemented in the prototype detector arms built for the NEXIS™ detector system. It allows for discrimination of the spectral signatures of scanned objects, thus making it a key enabling technology for automated material recognition.

Availability

XENA™ is available as chips packaged in a commercial 144-pin CQFP or on single-chip evaluation system with a connector for a 2x16, 1mmx1mm pitch pixel array CZT detector.

*XENA™ was developed with support CALTIP, CCAT, OTTC-CCAT Awards, following DOD-USDA project called ABIS (Automated Baggage Inspection System). It supersedes NOVA's ABIS detector technology developed under sponsorship of the Army/ARDEC and the USDA/APHIS.

Specifications

Number of channels:
 32 + two test channels  
Data Readout:
 160 counters read out sequentially over a 16-bit parallel data bus
Readout Time:
 1⁄4 20 &micros for all 160 counters
Counter dynamic range:
 16 bits
Count rate capability:
 > 2 x 106 counts per second per channel
Energy counting bins per channel:
 1 to 5 selectable
Comparator Levels:
 Independent comparator threshold voltages, 1⁄4 1.5-3.5V range common to all channels
Input loading capacitance:
 3.5 pF optimum
Pulse shaping time:
 Externally adjustable in two ranges:
250 to 4.0 &micros.
Input energy range:
 20-300keV
Input referred noise:
 approximatily = 1000 e rms (1⁄4 4.5 keV for CZT)
Power Consumption:
 500 mW nominal

Images

XENA™ evaluation board

 

 

XENA™ IC Layout

 

 

Data

  1. XENA X-ray response curves

Documents

  1. IEEE paper: “Multi-Energy X-ray Imaging with Linear CZT Pixel Arrays and Integrated Electronics.”
  2. NEXIS Brochure with XENA™ Specifications

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